Collection: Facility & Cooling

The Environment Your Hardware Lives In Determines How Long It Lasts

Every watt of power your AI infrastructure consumes becomes heat. A single 8-GPU server can generate 10–15 kilowatts of thermal load. A 10-rack AI cluster can generate 500 kilowatts or more. That heat has to go somewhere — and how you manage it determines whether your hardware runs at rated performance for years, or throttles, degrades, and fails prematurely under thermal stress.

Facility and cooling infrastructure is the category that most AI teams underinvest in until they have a problem. By then, the cost of retrofitting — in downtime, in hardware damage, in engineering time — far exceeds what a properly designed facility layer would have cost from the start. DVUN's Facility & Cooling collection exists to help teams get this right before the hardware goes in the rack, not after.

We stock the full range of physical infrastructure components for AI data center environments: racks and enclosures engineered for high-density GPU deployments, intelligent PDUs for power monitoring and management, structured cable management systems, precision airflow components, and liquid cooling solutions for the highest-density deployments where air cooling reaches its limits. Whether you're building a 2-rack pilot environment or a 50-rack private AI cloud, the physical infrastructure decisions you make here will define your operational experience for the life of the deployment.

Five Categories. One Integrated Physical Layer.

• Racks & Enclosures: High-density rack enclosures engineered for the weight, depth, and airflow requirements of GPU servers and high-power networking equipment.
• PDUs & Power: Intelligent rack PDUs with per-outlet monitoring, remote switching, and high-amperage configurations for GPU-dense deployments.
• Cable Management: Horizontal and vertical cable management systems that keep your rack organized, your airflow clean, and your maintenance windows short.
• Airflow: Blanking panels, hot-aisle containment, precision cooling units, and airflow optimization accessories for air-cooled AI environments.
• Liquid Cooling: Direct liquid cooling (DLC), rear-door heat exchangers, and immersion cooling components for ultra-high-density GPU deployments.

Thermal Design Principles for AI Infrastructure

The thermal design of an AI data center environment starts with power density. Modern GPU servers can exceed 30kW per rack — a density that air cooling can handle only with precision airflow management, and that liquid cooling handles more efficiently and reliably. DVUN's facility and cooling products are specified with real AI infrastructure power densities in mind, not the 5–10kW per rack assumptions that most enterprise data center equipment is designed for.

Key Specifications Across This Collection

• Rack load capacity: up to 2,000kg for high-density GPU deployments
• PDU amperage: 16A to 60A per phase, 3-phase configurations available
• Liquid cooling capacity: up to 100kW per rack with rear-door heat exchangers
• Airflow management: hot-aisle containment systems for 40–60% cooling efficiency improvement
• Cable management: supports up to 200 cables per vertical manager

Build the Environment. Protect the Investment.

Your GPU servers, networking, and storage represent a significant capital investment. The facility and cooling infrastructure that surrounds them is what protects that investment over its operational lifetime. DVUN's Facility & Cooling collection gives you the physical infrastructure to build an AI environment that runs reliably, efficiently, and safely — from day one through year five. Request a quote for complete facility infrastructure designs.